Dynamic Bonding

What is bonding?

Bonding is the secondary value accrual strategy of Sishi Finance. When users mint SISHI tokens, they are actually selling their assets in order to buy a bond from the protocol. Bonding actions are a cross between a fixed income product, a futures contract, and an option. The protocol quotes the minter with terms for a trade at a future date. These terms include a predefined amount of SISHI the minter will mint and the time when vesting is complete. The bond becomes redeemable as it vests. I.e. in a 5-day term, after 2 days into the term, 40% of the rewards can be claimed.

Bonding is an active, short-term strategy. The price discovery mechanism of the secondary bond market renders mints discounts more or less unpredictable. Therefore minting is considered a more active investment strategy that has to be monitored constantly in order to be more profitable as compared to staking.

Allowing users to purchase SISHI via Bonding allows Sishi Finance to accumulate its own liquidity. We call protocol own liquidity (POL). More POL ensures there is always locked exit liquidity in our trading pools to facilitate market operations and protect token holders. Since Sishi Finance becomes its own market, on top of additional certainty for SISHI investors, the protocol accrues more and more revenue from LP rewards bolstering our treasury.